Wafer-level imprinting process: scalable and cost-effective manufacturing on glass or polymer substrates
Beam shaping versatility: beam splitting, beam homogenization, dot/matrix projection, vortex beams
High transmission efficiency: optimized micro-structures, AR coating optional
Precision and repeatability: wafer-level pattern fidelity for consistent optical performance
Customizable formats: circular, linear, or freeform patterns
Applications: 3D sensing (VCSEL-based), AR/VR displays, LiDAR, biomedical diagnostics, machine vision, and laser material processing
Key Specifications
|
Materials |
Polymer on Glass (PoG) |
|
Wavelength Range |
400 – 2000 nm (customizable for UV / MWIR) |
|
Beam Shaping Functions |
Beam splitting, homogenization, dot/matrix projection, ring/freeform patterns |
|
Divergence / Expansion Angles |
1° – 120° (typical) |
|
Diffraction Efficiency |
80% – 95% (typical, depending on wavelength and design) |
|
Feature Size Accuracy |
< 200 nm (sub-micron level) |
|
Thermal Stability |
–40 °C to +125 °C (typical) |
Applications
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